Features
- It starts to absorb solder quickly, so you can get the job done in no time.
- This can significantly reduce work time in sites where frequent corrections are required.
Specifications in detail
Copper plate corrosion test: Passed (JIS Z 3197)
Copper mirror corrosion test: Breakthrough to less than 50% of the test range (IPC-TM-650)
Voltage application pressure humidity test: No migration (JIS Z 3197)
Width (mm): 2.5
Length (m): 25
Flux type: No cleaning type
Flux classification: ROM1 (IPC J-STD-004C)
Halide content [mass%]: 0.18%
HAKKO FR101-25250-J
